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Laser solder ball machine can be specifically divided into jet and drop modes according to different soldering process. This technique can be applied to solder devices with high precision, fine pitch and strange shape. The laser is transmitted through optical fiber and is located above the tin ball outlet. The high-pressure air inlet is placed on the annular chamber. The laser melts the tin ball, and the high-pressure inert gas pressure makes the molten tin ball fall, while ensuring that the molten tin will not be oxidized. This technology enjoys high accuracy and good soldering effect.
After laser preheating, the automatic wire feeding mechanism will send the tin wire to the specified position, and the laser will send the energy(below the temperature of the soldered components and beyond the melting point of the solder) to the soldering pad. Then the solder will melt to complete soldering.
Laser solder paste soldering uses laser as heat source to heat solder paste for melting. Suitable for FPC, PCB, wire, strange-shaped devices soldering
Laser Pre-formed solder machine is a lead-free, environmental-friendly product that can be assembled directly with the device and can be soldered by various heating methods such as laser or induction soldering. Compared with solder wire or solder paste, preformed solder has a series of advantages such as precised solder amount, easy to use and store, controlled flux residue, stable soldering performance, and beautiful and reliable solder joints.
