language
English
العربية
বাংলাদেশ
Български
Hrvatski
Česky
Dansk
Nederland
Esperanto
Slovenski
Filipino
Suomi
Français
Maori
Shqiptare
Georgian
Euskara
Deutsch
Ελλάδα
ישראל
इंडिया
Magyarország
Ísland
Indonesia
Irlanda
Italia
日本語
Sovensko
Հայաստան
한국
Kyrgyz
ປະເທດລາວ
Zulu
Latvian
Lithuanian
Luxembourgish
Latinus
Macedonian
Малайская
Maltese
Монгол улс
Cymraeg
ဗမာ
தமிழ்
नेपाल
Norge
ایران
Polska
Portugal
România
Российская
Србија
Slovak
Србија
Slovak
Bosanski
Slovenian
Беларус
España
Sverige
Точик
ประเทศไทย
Türk
Azərbaycan
Uzbek
Afrikaans
Việt Nam
Display
Release time:2022-11-02 15:17
1. Mass transfer
2. Massive soldering
3. Rework soldering: direct display, backlight-miniLED chip defective after soldering, three-in-one machine (with laser de-crystal, replenishment, laser soldering functions)
Optional split and integrated three-in-one rework machine, flexibly matched with customer production lines;
Automatic chip lighting detection and generating information code;
Combination of mechanical shovel and laser decrystallization;
The combination of CCD positioning and die-bonding machine can accurately find single-crystal single-die or multi-die;
Laser shaping and closed-loop temperature feedback ensure product quality
Previous page
Next page
Previous page
Next page