Feeding solder wire to ensure melting degree and increase the stability of wave soldering. Empty alarm, all compact packing to protect solder wire. Exceed supply of solder line could be control by separated power supply box
Laser solder ball soldering can also be divided into laser jet soldering and laser ball implantation soldering according to the type of process, is a new solder placement process. The main feature of this process is that it can realize the soldering of high precision, micro pitch and tiny shaped devices.
A four-layer filter device is adopted, including primary effect, medium effect, high efficiency filter and anti-secondary pollution filter; It protects people from poisonous and harmful gases like hydrocarbon, hydrogen compounds,etc.
Based on electromagnetic induction heating technology, equipped with three-axis motion platform and temperature control system, this product can realize the welding of thick plate through-hole pin devices, surface mount components, deep buried and other heterostructures. It has wide application range, short welding time and high production efficiency
