solder ball
Introduction
Tin ball is a key part of semiconductor packaging technology and belongs to technology-intensive products. It transmits electrical signals by connecting chips and motherboards. At present, our company can supply tin balls as small as 50um, and support customized specifications
Materials：Sn96.5/Ag3/Cu0.5/Sn63/Pb37
Size：0.2-0.76mm
Advantange
Good roundness, narrow size tolerance, less oxygen, high concentration (highCPK)
Application
Most widely used lead-free solder in various electronic products (computer boards, consumer electronics, communication products, instruments, automotive electronics, etc.
Technical Parameters
Most widely used lead-free solder in various electronic products (computer boards, consumer electronics, communication products, instruments, automotive electronics, etc.
