Focus on the area of laser soldering

Laser cutting machine

Attach the whole PCB/FPC/RF and IC carrier to the special fixture and use laser to cut the plate. (The device can be compatible with efficient and high-precision cutting of TouchID, Type-C, TF-Card, LGA and other products)
Laser cutting machine

Introduction:

Attach the whole PCB/FPC/RF and IC carrier to the special fixture and use laser to cut the plate. (The device can be compatible with efficient and high-precision cutting of TouchID, Type-C, TF-Card, LGA and other products)

Advantange:

　　1. Linear motor stage ——high precision, high speed, stable

　　2. Galvanometer scanning system ——fast speed, good cutting effect

　　3. CCD system—— precise positioning, reduce clamping requirements

　　4. Humanized design——easy to operate

　　5. Modular design—— easy to expand the function

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Application

This equipment is suitable for semiconductor and 3C electronic industry - Attaching FPC/PCB/RF products on the special fixture and using laser to cut the board (also compatible with TouchID, Type-C, CCM, LGA, TF card and other products of high efficiency and high precision cutting, IC carrier board slotting applications).

Technical Parameters

This equipment is suitable for semiconductor and 3C electronic industry - Attaching FPC/PCB/RF products on the special fixture and using laser to cut the board (also compatible with TouchID, Type-C, CCM, LGA, TF card and other products of high efficiency and high precision cutting, IC carrier board slotting applications).