Focus on the area of laser soldering

Laser solder ball soldering machine

Laser solder ball machine can be specifically divided into jet and drop modes according to different soldering process. This technique can be applied to solder devices with high precision, fine pitch and strange shape. The laser is transmitted through optical fiber and is located above the tin ball outlet. The high-pressure air inlet is placed on the annular chamber. The laser melts the tin ball, and the high-pressure inert gas pressure makes the molten tin ball fall, while ensuring that the molten tin will not be oxidized. This technology enjoys high accuracy and good soldering effect.
Laser solder ball soldering machine

Features：

1. Suitable for high-precision :±10um

2. Components'min. clearance: 100um

3. Solder ball diameters: 0.1mm -1.8mm

4. Applied to tin, gold, silver coated surface

5. Yield: >99% .

Laser parameters:

1. Power：50-200W(Optional)

2. Wavelength: 1064±5nm

3. Type: CW laser

1.Fluxless.

2.Mask/ Stencil-less

3.Environmental-friendly

4.High precision

5.Low thermal stress

6.3D soldering

Other parameters:

1. Dimension：1m* 1.1m *1.65m(L*W*H)

2. Power supply：AC220V, 15A

3. Fixture size: can be customized

4. Compressed air：0.6MPa

5. Weight:850kg

6. Nitrogen consumption：0.6L/H

7. Power consumption:2kw

8. CCD: 5 mega-pixel; ±5 resolution

9. Mechanical repetitive precision:±0.2mm

10. Control system: PLC+CCD screen

11. Solder ball: 0.1mm-1.8mm

Strengths：

1.Fluxless.

2.Mask/ Stencil-less

3.Environmental-friendly

4.High precision

5.Low thermal stress

6.3D soldering

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Application

◆Micro-electronics: High-definition camera module,mobile camera, soft board connection, point soldering, precised sound control device, sensor soldering, etc.

◆Military: high-precision electronic products

◆Other industries: wafer, optoelectronic products,MEMS, sensor production,BGA,HDD (HGA,HSA) , high-precision components, high precision electronic soldering.

Technical Parameters

◆Micro-electronics: High-definition camera module,mobile camera, soft board connection, point soldering, precised sound control device, sensor soldering, etc.

◆Military: high-precision electronic products

◆Other industries: wafer, optoelectronic products,MEMS, sensor production,BGA,HDD (HGA,HSA) , high-precision components, high precision electronic soldering.