Laser welding is to radiate high intensity laser beam to metal surface. Through the interaction between laser and metal, the metal absorbs the laser and converts it into heat energy, which makes the metal melt and then cool and crystallize to form welding.
Attach the whole PCB/FPC/RF and IC carrier to the special fixture and use laser to cut the plate. (The device can be compatible with efficient and high-precision cutting of TouchID, Type-C, TF-Card, LGA and other products)
Laser removes impurities like cured glue, ink, EMC and residual tin on the product .
Laser marking uses laser beam to permanently mark the surface of a variety of different substances. The effect of marking is to reveal the deep material by evaporating surface material, or to "etch" the surface material by chemical-physical changes caused by light energy, or to burn away part of the material by light energy to reveal the desired etched pattern or text.
