DO solder ball
Tin ball is a key part of semiconductor packaging technology and belongs to technology-intensive products. It transmits electrical signals by connecting chips and motherboards. At present, our company can supply tin balls as small as 50um, and support customized specifications
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Product Description
Introduction
Tin ball is a key part of semiconductor packaging technology and belongs to technology-intensive products. It transmits electrical signals by connecting chips and motherboards. At present, our company can supply tin balls as small as 50um, and support customized specifications
Materials：Sn96.5/Ag3/Cu0.5/Sn63/Pb37
Size：0.2-0.76mm
Advantange
Good roundness, narrow size tolerance, less oxygen, high concentration (highCPK)
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